Annual rank56
Sweden · Technology
Mycronic
Mycronic's product areas include PCB assembly, photomask equipment, dispensing and coating, bare-board testing and die bonding.
FY2022–FY2025
FY2022–FY2025
FY2022–FY2025
current context only
Company profile
Machines that pattern, populate and package electronics
Mycronic is not itself a chip, display or circuit-board maker. It builds machines used at several physical production steps: a mask writer creates the master pattern later transferred to a wafer or display substrate; a PCB line deposits solder paste, places components and inspects the assembled board; a die bonder positions a tiny semiconductor die inside a package; and dispensing systems add adhesives, underfill or protective coatings. Precision, repeatability and rapid product changeovers link these otherwise different niches.
Before wafer exposure
A mask writer turns a circuit design into a reusable light pattern
A photomask is an opaque plate with transparent areas arranged as one layer of a design. During lithography, light passes through that pattern and transfers it to a wafer or display substrate; several masks build successive layers. Mycronic's Prexision writers serve large display masks, while SLX addresses masks for mature semiconductor nodes. The company writes the mask, not the finished chip.
- See what a photomask does The master pattern used to expose successive device layers
- Compare Prexision and SLX Large display masks and mature-node semiconductor masks
- Digitalise a mask writer Equipment data, uptime and process decisions across a long-lived tool
- Read the SLX interview Why a mask writer links circuit design to the physical wafer
- ▶ VideoWatch the SLX interview Official English Mycronic film with a complete issuer transcript
Populating a circuit board
Paste, place and inspect: one production line follows the board
A PCB line first deposits solder paste, then places components from reels and finally checks position and solder joints. MY700 can jet paste from a software pattern, MYPro A40 places components and GenI prepares automated optical inspection. At US manufacturer Z-AXIS, a line combining A40 placement, S30 printing and MYTower storage reportedly cut large-job throughput time by about one third.
- Walk through a PCB assembly line Storage, printing, placement, inspection and production software
- Explore MY700JD Software-defined jet printing and precision dispensing
- See the MYPro A40 placer High-mix component placement at up to 59,000 components per hour
- Understand GenI inspection Generative 3D optical-inspection programming for varied production
- Visit the Z-AXIS factory case Three assembly lines, automated storage and reported throughput gains
Packaging the semiconductor
A die bonder places the tiny chip where the outside world can reach it
After a wafer is diced, each small semiconductor block is a die. A die bonder picks it up, aligns it and attaches it to a package, substrate or another component. MRSI systems combine machine vision, material handling and micron-level placement. TESAT uses MRSI equipment in automated microwave-module production, while VPT moved defence and aerospace component assembly from manual work toward automated die bonding.
- Understand die bonding The step between a diced wafer and a packaged component
- Explore MRSI-HVM High-volume placement, machine vision and process flexibility
- Visit TESAT's microwave factory Automated placement and dispensing for satellite and terrestrial modules
- See VPT automate die bonding A shift from manual assembly for defence, aerospace and medical components
- ▶ VideoWatch MRSI-HVM at work Official product film with English on-screen process headings
Materials, niches and support
Microscopic material deposits sit inside a wider specialist portfolio
Dispensing tools jet repeatable amounts of adhesive, epoxy, underfill, sealant or solder paste without contacting the workpiece; the MY700 tutorial shows the ejector mechanism. Mycronic combines this field with selected electronics-production niches including bare-board testing, photonic interconnects, magnetic testing and applied plasma. Seven R&D centres and sales or support locations across Europe, Asia and North America connect development with installed equipment.
- Explore in-line dispensing Adhesives, epoxies, sealants and solder paste placed without contact
- Map the specialist portfolio Eight selected electronics-production areas and the acquisition model
- Visit Mycronic's R&D network Seven centres translating production needs into equipment
- Find sales and support locations Operational contacts across Europe, Asia and North America
- ▶ VideoWatch the MY700 ejector Official English-captioned tutorial showing non-contact material jetting
Official profile sources: Organization | Mycronic · Bringing tomorrow's electronics to life | Mycronic · Order received for a mask writer based on Mycronic's replacement strategy · About us | Mycronic
Current 2026 update
What has changed in 2026?
Order announced on 23 July 2026 · 23 July 2026
Order announced on 23 July 2026latest official update
4company-specific highlights
+55%2026 stock return · context only
Net sales
First-half net sales rose 16.9% to SEK 4,919 million.
Profit
Profit attributable to owners of the parent rose 16.4% to SEK 1,241 million.
Order intake and division mix
Order intake rose 60.7% to SEK 5.45 billion. Global Technologies and High Volume were strong, while standard industrial business in PCB Assembly Solutions remained weak, especially in Europe; restructuring cost through 2027 is estimated at SEK 100 million.
SLX mask-writer order
Mycronic received an SLX mask-writer order valued at USD 5–7 million, with delivery planned for Q2 2027.
Official 2026 sources: Interim Report January-June 2026 · 14 July 2026 · Interim Report January-June 2026 · 14 July 2026 · Mycronic receives order for an SLX mask writer · 23 July 2026
Annual record
Ranking history
Future editions add rows; they do not rewrite the 2026 record.
| Edition | Measurement period | Rank | Revenue growth | Net-income growth | Stock return |
|---|---|---|---|---|---|
| 2026 | FY2022–FY2025 | 56 | +60% | +117% | +139% |