Annual rank56
Sweden · Technology
Mycronic
Mycronic's product areas include PCB assembly, photomask equipment, dispensing and coating, bare-board testing and die bonding.
FY2022–FY2025
FY2022–FY2025
FY2022–FY2025
current context only
Company profile
Machines that pattern, populate and package electronics
Mycronic is not itself a chip, display or circuit-board maker. It builds machines used at several physical production steps: a mask writer creates the master pattern later transferred to a wafer or display substrate; a PCB line deposits solder paste, places components and inspects the assembled board; a die bonder positions a tiny semiconductor die inside a package; and dispensing systems add adhesives, underfill or protective coatings. Precision, repeatability and rapid product changeovers link these otherwise different niches.
Before wafer exposure
A mask writer turns a circuit design into a reusable light pattern
A photomask is an opaque plate with transparent areas arranged as one layer of a design. During lithography, light passes through that pattern and transfers it to a wafer or display substrate; several masks build successive layers. Mycronic's Prexision writers serve large display masks, while SLX addresses masks for mature semiconductor nodes. The company writes the mask, not the finished chip.
- See what a photomask does The master pattern used to expose successive device layers
- Compare Prexision and SLX Large display masks and mature-node semiconductor masks
- Digitalise a mask writer Equipment data, uptime and process decisions across a long-lived tool
- Read the SLX interview Why a mask writer links circuit design to the physical wafer
- ▶ VideoWatch the SLX interview Official English Mycronic film with a complete issuer transcript
Populating a circuit board
Paste, place and inspect: one production line follows the board
A PCB line first deposits solder paste, then places components from reels and finally checks position and solder joints. MY700 can jet paste from a software pattern, MYPro A40 places components and GenI prepares automated optical inspection. At US manufacturer Z-AXIS, a line combining A40 placement, S30 printing and MYTower storage reportedly cut large-job throughput time by about one third.
- Walk through a PCB assembly line Storage, printing, placement, inspection and production software
- Explore MY700JD Software-defined jet printing and precision dispensing
- See the MYPro A40 placer High-mix component placement at up to 59,000 components per hour
- Understand GenI inspection Generative 3D optical-inspection programming for varied production
- Visit the Z-AXIS factory case Three assembly lines, automated storage and reported throughput gains
Packaging the semiconductor
A die bonder places the tiny chip where the outside world can reach it
After a wafer is diced, each small semiconductor block is a die. A die bonder picks it up, aligns it and attaches it to a package, substrate or another component. MRSI systems combine machine vision, material handling and micron-level placement. TESAT uses MRSI equipment in automated microwave-module production, while VPT moved defence and aerospace component assembly from manual work toward automated die bonding.
- Understand die bonding The step between a diced wafer and a packaged component
- Explore MRSI-HVM High-volume placement, machine vision and process flexibility
- Visit TESAT's microwave factory Automated placement and dispensing for satellite and terrestrial modules
- See VPT automate die bonding A shift from manual assembly for defence, aerospace and medical components
- ▶ VideoWatch MRSI-HVM at work Official product film with English on-screen process headings
Materials, niches and support
Microscopic material deposits sit inside a wider specialist portfolio
Dispensing tools jet repeatable amounts of adhesive, epoxy, underfill, sealant or solder paste without contacting the workpiece; the MY700 tutorial shows the ejector mechanism. Mycronic combines this field with selected electronics-production niches including bare-board testing, photonic interconnects, magnetic testing and applied plasma. Seven R&D centres and sales or support locations across Europe, Asia and North America connect development with installed equipment.
- Explore in-line dispensing Adhesives, epoxies, sealants and solder paste placed without contact
- Map the specialist portfolio Eight selected electronics-production areas and the acquisition model
- Visit Mycronic's R&D network Seven centres translating production needs into equipment
- Find sales and support locations Operational contacts across Europe, Asia and North America
- ▶ VideoWatch the MY700 ejector Official English-captioned tutorial showing non-contact material jetting
Official profile sources: Organization | Mycronic · Bringing tomorrow's electronics to life | Mycronic · Order received for a mask writer based on Mycronic's replacement strategy · About us | Mycronic
Current 2026 update
What is changing at Mycronic in 2026?
Three kinds of customer demand now pull different parts of Mycronic: AI factory expansion, defence full-line production and separate semiconductor and display photomask cycles.
The change in one sentence
The portfolio is not moving as one market.
AI reaches several electronics-production steps, defence customers buy complete PCB lines, and new versus replacement mask-writer orders follow different end markets.
Four lenses on 2026
The same four-quadrant format used in the Company profile.
01 · AI across factory steps
AI demand reaches PCB testing, server cooling and optical-module assembly
Mycronic's H1 report connects AI infrastructure to three physical production steps across two divisions. Within Global Technologies, PCB Test serves producers of advanced server boards used in data centres. High Volume sees opportunities in dispensing materials that remove heat from servers and in dispensing and final assembly for optical modules. The same report says AI-led PCB investment includes manufacturers already in AI segments and companies trying to enter, while China-plus-N strategies add capacity in Southeast Asia. Global Technologies' Q2 order intake exceeded SEK 1 billion for the first time, supporting rather than defining this operating story.
- Current signalThree AI-linked process areas across two divisions · Global Technologies Q2 orders SEK 1.111bn
- Why it mattersAI infrastructure is pulling multiple precision processes across Mycronic's portfolio rather than creating demand for one isolated machine.
- H1 AI and defence process map Mycronic · 14 July 2026
02 · Defence production lines
Record defence orders arrive while standard industrial demand remains weak
PCB Assembly Solutions received its two largest-ever orders from defence customers in the United States and Europe. Mycronic says defence buyers tend to order complete production lines rather than individual machines, making each order larger. That strength does not describe the whole division: standard industrial demand remained weak, especially in Europe; Q2 sales fell 8% and EBIT was negative SEK 44 million. The division has begun a restructuring programme intended to lift its EBIT margin above 10% by the end of 2027. Estimated total restructuring cost is SEK 100 million, of which SEK 43 million had been taken by the end of June.
- Current signalTwo largest defence orders ever · full production lines · end-2027 margin target, not current performance
- Why it mattersDefence demand changes order size and solution scope, but restructuring and the weak standard-industrial franchise remain separate execution problems.
- H1 AI and defence process map Mycronic · 14 July 2026
03 · Two photomask markets
A new SLX customer and a Prexision replacement order point to different demand cycles
On 13 August, a new customer in Asia ordered an SLX laser mask writer for semiconductor photomasks, worth USD 4-6 million with delivery planned for Q1 2027. On 28 August, an existing customer placed a USD 21-24 million replacement order for a Prexision 80 Evo, planned for Asian delivery in Q2 2027, to modernise production of complex display photomasks. The orders therefore differ in customer status, technology and purpose: SLX expands the semiconductor-mask customer base, while Prexision renews installed display equipment. They also remain orders with planned delivery dates, not delivered systems or recognised revenue.
- Current signalNew-customer SLX USD 4-6m · existing-customer Prexision replacement USD 21-24m · planned 2027 delivery
- Why it mattersCustomer expansion and installed-base replacement can support the same division through separate semiconductor and display cycles without being read as identical orders.
- New-customer SLX order Mycronic · 13 August 2026
- Prexision installed-base replacement Mycronic · 28 August 2026
04 · What to watch
Three questions for the next disclosures
The next disclosures should show whether AI demand broadens, defence orders improve division economics and the two photomask order types convert on schedule.
- AI breadthDoes Mycronic quantify how AI demand is split among PCB Test, server-cooling dispensing and optical-module assembly?
- Defence and restructuringDo the complete-line defence orders eventually translate into improved PCB Assembly revenue and margins while the restructuring stays on its end-2027 path?
- Mask-writer conversionDo the August SLX and Prexision systems deliver in their planned 2027 quarters, and does the new SLX customer return with follow-on business?
Annual record
Ranking history
Future editions add rows; they do not rewrite the 2026 record.
| Edition | Measurement period | Rank | Revenue growth | Net-income growth | Stock return |
|---|---|---|---|---|---|
| 2026 | FY2022–FY2025 | 56 | +60% | +117% | +139% |