Annual rank98
Netherlands · Technology
ASM International
Semiconductor equipment provider focused on deposition tools, including atomic layer deposition and silicon epitaxy systems.
FY2022–FY2025
FY2022–FY2025
FY2022–FY2025
current context only
Company profile
Machines that add the functional layers inside a semiconductor
ASM International builds tools used in wafer fabrication, before a silicon wafer is cut into individual chips or packaged. Its equipment adds functional layers that form transistor gates, contacts and power-device structures: atomic layer deposition lays down ultrathin conformal films, plasma-enhanced deposition works at lower temperatures, vertical furnaces treat many wafers together and epitaxy grows a crystal layer with controlled composition. ASM combines materials research with platforms designed for repeatable factory operation.
Inside the vacuum chamber
A wafer receives a film one atomic layer at a time
Inside an ALD chamber, a wafer sees one precursor gas, a purge, a second reactant and another purge. Each surface reaction stops by itself, so the cycle adds an exceptionally controlled film even around narrow three-dimensional features. Those films can insulate, conduct or separate parts of a transistor. ASM's official explainer makes a normally sealed chipmaking step visible.
- See how ALD builds a film Alternating gas pulses, self-limiting reactions and conformal coverage
- Read the ALD explainer ASM's non-specialist introduction to the nanoscale process
- ▶ VideoWatch atomic layer deposition Official English ASM animation of the layer-by-layer sequence
From process to production
Several chambers turn a precise reaction into factory throughput
High-volume fabs need more than a chemical reaction: wafers must enter, move through chambers and leave with the same result around the clock. Synergis performs thermal ALD, while XP8 DCM and Magma use plasma-enhanced processes or PECVD across several chambers. SONORA takes a different route, treating batches of up to 150 wafers in a vertical furnace.
- Explore Synergis Thermal ALD with up to eight independent chambers
- Explore XP8 DCM PEALD Plasma-enhanced ALD for 300 mm semiconductor wafers
- Explore XP8 DCM PECVD Low-temperature dielectric films across eight reaction chambers
- Explore XP8 Magma Parallel plasma-enhanced processing for logic and memory
- See the SONORA batch furnace Thermal processing of as many as 150 wafers together
Growing the crystal
Epitaxy changes the wafer by extending its crystal structure
Epitaxy continues the wafer's crystal structure while changing its composition and electrical properties. Silicon, silicon-germanium and silicon-phosphorus layers can form transistor channels or source and drain regions; silicon carbide is used for power devices. Epsilon and Intrepid serve silicon applications, while PE2O8 is a dual-chamber platform for 200 mm silicon-carbide wafers in volume production.
- Understand epitaxy Crystal growth, silicon alloys and device applications
- Explore Intrepid ES Multi-reactor epitaxy for advanced silicon devices
- Explore Epsilon 2000 Single-wafer silicon epitaxy and selective processing
- Explore PE2O8 Dual-chamber epitaxy for 200 mm silicon-carbide wafers
- ▶ VideoWatch epitaxy explained Official English ASM film on growing a crystalline layer
- ▶ VideoWatch PE2O8 in context Official English product film for the silicon-carbide platform
From laboratory to installed tool
Research, product development and service form one operating chain
ASM describes a development path that starts with materials and process research in Helsinki, integrates candidate steps at imec in Leuven and finishes products at development centres. In Korea, its US$100 million Hwaseong centre combines manufacturing, R&D and two cleanrooms, with a focus on plasma-enhanced ALD. Service products then address uptime, process drift, maintenance and productivity in customer fabs.
- Follow ASM's three-stage R&D path Materials research, device integration and production-tool development
- Visit the Hwaseong centre Manufacturing, R&D and cleanrooms in South Korea
- Explore service products Maintenance, tool matching, drift control and productivity support
- Open the 2025 annual-report hub Group operations, technology, risk and governance in one official source
Official profile sources: ASM Annual Report 2024 · Our story | ASM
Current 2026 update
2026 highlights
Q1 2026 · 21 April 2026
Q1 2026latest official update
4curated 2026 highlights
+67%2026 stock return · context only
Record operating margin
ASM achieved a quarterly record adjusted operating margin of 33.1% while continuing to increase investment in research and development.
AI-led demand
AI-led demand accelerated as customers invested in capacity intended to support the long-term expansion of AI infrastructure.
Technology pipeline
Customer research engagements expanded across additional ALD and Epi layers, 4F² DRAM applications and advanced packaging.
The 1.4nm frontier
ASM expected customer pilot-line investments for the 1.4nm node to begin in the second half of 2026.
Official 2026 sources: ASM reports first quarter 2026 results · 21 April 2026
Annual record
Ranking history
Future editions add rows; they do not rewrite the 2026 record.
| Edition | Measurement period | Rank | Revenue growth | Net-income growth | Stock return |
|---|---|---|---|---|---|
| 2026 | FY2022–FY2025 | 98 | +32% | +86% | +124% |