Annual rank48
Germany · Technology
SUSS MicroTec
SUSS lists photomask processing, high-precision imaging, coating and bonding systems among its activities.
FY2022–FY2025
FY2022–FY2025
FY2022–FY2025
current context only
Company profile
Precision tools around the semiconductor wafer
SUSS MicroTec makes process equipment used around the wafer rather than the finished consumer chip. Its systems coat, print and expose materials; align masks and substrates; temporarily or permanently bond wafers and dies; and clean, bake or develop photomasks. The portfolio serves research laboratories and automated factories producing advanced packages, MEMS, compound semiconductors and other specialised devices.
AI and high-bandwidth memory
Temporarily support a wafer while it becomes extremely thin
High-bandwidth memory stacks require thin wafers. SUSS explains that temporary bonding attaches a device wafer to a carrier for thinning and processing; debonding then separates it and cleaning removes adhesive residues. XBS300 performs the bond step and XBC300 Gen2 combines debonding and cleaning, turning an invisible handling problem into a linked production workflow.
- Understand temporary bonding Why thin device wafers need a carrier during processing
- See the XBS300 bonding system Automated temporary bonding for 200- and 300-millimetre wafers
- Follow debonding and cleaning XBC300 Gen2 removes the carrier and adhesive residues
- Connect the workflow to AI hardware Official explanation of temporary bonding for high-bandwidth memory
3D integration
Align and join wafers or individual dies with sub-micron control
Permanent and hybrid bonding join layers that remain together in the finished package. The XBC300 Gen2 D2W/W2W platform supports wafer-to-wafer, collective die-to-wafer and sequential die-to-wafer processes in one configurable system. SUSS positions the approach for advanced packaging and 3D integration where dense interconnects demand extremely accurate cleaning, alignment and bonding.
- Explore permanent bonding Processes and platforms from development to production
- Inspect the hybrid-bonding allrounder Wafer-to-wafer and two die-to-wafer modes on XBC300 Gen2
- Open the equipment map Official overview of SUSS systems and application fields
Patterns and materials
Expose, print and prepare the structures used in chipmaking
MA200 Gen3 aligns a photomask and substrate before exposure in volume production. JETx deposits functional materials selectively without physical contact, while SUSS and Heraeus have paired inkjet equipment with metallic inks for semiconductor manufacturing. MaskTrack Smart BD serves the upstream pattern-maker by automating photomask baking and development. At the beginning of Q3 2026, SUSS shipped its first scanner for panel processing to a customer in Taiwan; the H1 release does not name the model, customer or order value.
- Open the first panel-scanner milestone First shipment, Taiwan destination and disclosure boundary
- See the MA200 Gen3 mask aligner Automated exposure for MEMS, power, RF and packaging processes
- Explore JETx material printing Selective non-contact deposition in production
- Read the Heraeus inkjet collaboration Equipment and metallic inks developed as a combined process
- Enter the photomask process Automated baking and development with MaskTrack Smart BD
Installed base and footprint
Service relationships, Taiwan production and a planned Karlsruhe hub
SUSS reports more than 8,000 installed systems and supports them with maintenance, spare parts, upgrades, training and process services. Its official locations page spans Europe, Asia and North America. A newer Zhubei production site adds 6,300 square metres of clean-room space in Taiwan, close to a region that supplied most of group order intake when the lease was announced. SUSS also plans an approximately EUR 45 million application and development center in Karlsruhe to bring customers, research partners and product teams together. Separately, a letter of intent with Baden-Württemberg and Karlsruhe Institute of Technology (KIT) would establish a state-funded professorship of up to EUR 5 million. SUSS expects 300 to 350 people at the center over the long term and says the broader expansion could add up to 100 jobs; the release does not say whether the figures overlap. The project remains subject to further progress and final decisions.
- Enter the planned Karlsruhe hub Center investment, jobs and separate KIT professorship LOI
- Explore life-cycle service Maintenance, parts, upgrades, training and process support
- Map SUSS locations Company and service presence across three regions
- Visit the expanded Taiwan footprint Zhubei production and clean-room capacity near Asian customers
- ▶ VideoWatch SUSS equipment and clean rooms Official language-neutral film embedded on the English homepage
Official profile sources: Shaping the Next Era of Semiconductor Innovation | SUSS
Current 2026 update
What is changing at SUSS MicroTec in 2026?
An AI-linked coating order, a first panel-processing scanner shipment and a planned Karlsruhe center advance different parts of SUSS's advanced-packaging business.
The change in one sentence
The advanced-packaging strategy is becoming orders, new equipment and a planned applications hub.
A major coating order contributes to record backlog, a first panel scanner has shipped, and the Karlsruhe plan would connect customers, research partners and SUSS product teams.
Four lenses on 2026
The same four-quadrant format used in the Company profile.
01 · AI chip modules
A EUR 115 million order links SUSS coating solutions to AI chip modules
A major second-quarter order worth approximately EUR 115 million covers coating solutions for an unnamed outsourced semiconductor assembly and test (OSAT) customer that supplies a leading participant in the AI chip-module value chain. It is included within H1 order intake of EUR 410.0 million and a record order book of EUR 473.7 million. Around EUR 220 million is currently scheduled for 2027 delivery, not guidance or a revenue forecast. Orders remain ahead of deliveries: H1 sales were EUR 202.8 million, down 23.9% from the prior-year figure, which SUSS says was adjusted for accounting changes; Q2 sales and profitability improved from Q1 and 2026 guidance was confirmed.
- Current signalc. EUR 115m order within EUR 410m H1 intake · c. EUR 220m scheduled for 2027, not guidance
- Why it mattersThe order ties SUSS coating solutions to an AI-linked OSAT supply chain, while both the OSAT customer and end client remain undisclosed and sales still lag orders.
- H1 AI-chain orders and first panel scanner SUSS · 6 August 2026
02 · Customer applications
A planned Karlsruhe center would bring customers, research partners and product teams together
SUSS plans to invest approximately EUR 45 million in an Advanced Packaging application and development center in Karlsruhe. The center is intended to combine customer applications, product development and research partners. Separately, a letter of intent with Baden-Württemberg and Karlsruhe Institute of Technology would create a state-funded professorship of up to EUR 5 million. SUSS expects 300 to 350 people at the center over the long term and says the broader expansion could add up to 100 jobs; the release does not reconcile the two figures. Final decisions remain pending.
- Current signalSUSS c. EUR 45m planned center investment · separate state-funded professorship up to EUR 5m · final decisions pending
- Why it mattersThe center would centralise customer applications, research partnerships and product development; approvals, construction timing and opening date remain unresolved.
- Karlsruhe Advanced Packaging center SUSS · 29 July 2026
03 · Panel processing
SUSS ships its first panel-processing scanner to Taiwan
At the beginning of the third quarter, SUSS shipped its first scanner for panel processing to a customer in Taiwan. The issuer also said additional product launches were planned for the second half of 2026. The H1 release does not identify the scanner model, customer, dimensions, order value or acceptance status, so the milestone shows a first shipment rather than proven repeat demand.
- Current signalFirst panel-processing scanner shipped · Taiwan · further launches planned for H2
- Why it mattersThe shipment is a tangible new-product milestone in Advanced Packaging; repeat orders, customer acceptance and product economics are not yet disclosed.
- H1 AI-chain orders and first panel scanner SUSS · 6 August 2026
04 · What to watch
Three questions for the next disclosures
The next disclosures should separate one large customer order from repeat demand, a planned center from an approved build and a first shipment from established product adoption.
- Order conversionWhich coating solutions and delivery milestones convert the EUR 115 million order and scheduled 2027 backlog into accepted customer deliveries?
- Karlsruhe approvalsDo governing bodies approve the project, when does construction start, and which customer or research programs are announced for the center?
- Panel-scanner adoptionDoes SUSS name the product, record repeat orders and complete customer acceptance after the first Taiwan shipment?
Annual record
Ranking history
Future editions add rows; they do not rewrite the 2026 record.
| Edition | Measurement period | Rank | Revenue growth | Net-income growth | Stock return |
|---|---|---|---|---|---|
| 2026 | FY2022–FY2025 | 48 | +94% | +88% | +164% |