Annual rank48
Germany · Technology
SUSS MicroTec
SUSS lists photomask processing, high-precision imaging, coating and bonding systems among its activities.
FY2022–FY2025
FY2022–FY2025
FY2022–FY2025
current context only
Company profile
Precision tools around the semiconductor wafer
SUSS MicroTec makes process equipment used around the wafer rather than the finished consumer chip. Its systems coat, print and expose materials; align masks and substrates; temporarily or permanently bond wafers and dies; and clean, bake or develop photomasks. The portfolio serves research laboratories and automated factories producing advanced packages, MEMS, compound semiconductors and other specialised devices.
AI and high-bandwidth memory
Temporarily support a wafer while it becomes extremely thin
High-bandwidth memory stacks require thin wafers. SUSS explains that temporary bonding attaches a device wafer to a carrier for thinning and processing; debonding then separates it and cleaning removes adhesive residues. XBS300 performs the bond step and XBC300 Gen2 combines debonding and cleaning, turning an invisible handling problem into a linked production workflow.
- Understand temporary bonding Why thin device wafers need a carrier during processing
- See the XBS300 bonding system Automated temporary bonding for 200- and 300-millimetre wafers
- Follow debonding and cleaning XBC300 Gen2 removes the carrier and adhesive residues
- Connect the workflow to AI hardware Official explanation of temporary bonding for high-bandwidth memory
3D integration
Align and join wafers or individual dies with sub-micron control
Permanent and hybrid bonding join layers that remain together in the finished package. The XBC300 Gen2 D2W/W2W platform supports wafer-to-wafer, collective die-to-wafer and sequential die-to-wafer processes in one configurable system. SUSS positions the approach for advanced packaging and 3D integration where dense interconnects demand extremely accurate cleaning, alignment and bonding.
- Explore permanent bonding Processes and platforms from development to production
- Inspect the hybrid-bonding allrounder Wafer-to-wafer and two die-to-wafer modes on XBC300 Gen2
- Open the equipment map Official overview of SUSS systems and application fields
Patterns and materials
Expose, print and prepare the structures used in chipmaking
MA200 Gen3 aligns a photomask and substrate before exposure in volume production. JETx deposits functional materials selectively without physical contact, while SUSS and Heraeus have paired inkjet equipment with metallic inks for semiconductor manufacturing. MaskTrack Smart BD serves the upstream pattern-maker by automating photomask baking and development.
- See the MA200 Gen3 mask aligner Automated exposure for MEMS, power, RF and packaging processes
- Explore JETx material printing Selective non-contact deposition in production
- Read the Heraeus inkjet collaboration Equipment and metallic inks developed as a combined process
- Enter the photomask process Automated baking and development with MaskTrack Smart BD
Installed base and footprint
Equipment remains a service relationship after installation
SUSS reports more than 8,000 installed systems and supports them with maintenance, spare parts, upgrades, training and process services. Its official locations page spans Europe, Asia and North America. A newer Zhubei production site adds 6,300 square metres of clean-room space in Taiwan, close to a region that supplied most of group order intake when the lease was announced.
- Explore life-cycle service Maintenance, parts, upgrades, training and process support
- Map SUSS locations Company and service presence across three regions
- Visit the expanded Taiwan footprint Zhubei production and clean-room capacity near Asian customers
- ▶ VideoWatch SUSS equipment and clean rooms Official language-neutral film embedded on the English homepage
Official profile sources: Shaping the Next Era of Semiconductor Innovation | SUSS
Current 2026 update
What has changed in 2026?
Three months ended 31 March 2026 · 7 May 2026
Three months ended 31 March 2026latest official update
4company-specific highlights
+102%2026 stock return · context only
Order intake
First-quarter order intake rose 69.5% to a record EUR 149.3 million.
Sales
First-quarter sales fell 30.7% to EUR 86.5 million after low order intake in summer 2025.
EBIT margin
The EBIT margin was 4.3%, down from 18.0% in Q1 2025.
2026 outlook
SUSS confirmed 2026 guidance for EUR 425–485 million of sales, a 35–37% gross margin and an 8–10% EBIT margin.
Official 2026 sources: Order intake reaches record level in the first quarter of 2026 · 7 May 2026
Annual record
Ranking history
Future editions add rows; they do not rewrite the 2026 record.
| Edition | Measurement period | Rank | Revenue growth | Net-income growth | Stock return |
|---|---|---|---|---|---|
| 2026 | FY2022–FY2025 | 48 | +94% | +88% | +164% |